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What is LSR? | BSOM | LSR Reliability

What is LSR?

Laser Selective Reflow(LSR) is designed to deliver a uniform defocused laser beam over a specifically tailored area on a PCB. The uniform defocused beam is controlled and delivered to the product via the BSOM(Beam Shaping Optic Module system) on user defined area. This unique feature permits the user to implement novel soldering solutions not possible with past techniques.  It also allows the selective application of energy to locations that require soldering while not heating up potentially thermally sensitive areas. LSR is potentially a means to also mitigate or even eliminate the warpage of various packages. It provides super reliable and fast, only 1~3 seconds laser bonding per selected area, bonding process. It was made possible by highly uniform optic system and distinctive recipe developed by Laserssel. 

Very Fast Tact time

LSR

Total 0.5~4sec

Mass Reflow

Total 4~8min

  • Every Process is super accelerated.

Strength of LSR

  • ​​Extremely Fast Ramp up : within 0.5sec

  • Extremely Fast Cooling Rate : 65°C/sec (Mass Reflow  3.7°C/sec)

  • Highly Selective Area Heating : Heat Si only

  • Smaller Warpage : No PCB elongation

  • Less Floor Space : No 5~10 steps temp zone required.

  • Energy Saving : No need 10~30m /hour N2 Purge

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LSR vs. Mass Reflow

vs

  • Conventional Reflow heats up entire atmosphere. But, LSR only heats up where soldering takes place. LSR will give minimum damage to substrates that goes through reflow.

Beam Uniformity of BSOM

  • Beam size 45x45mm, Uniformity X: 88.329% / Y:90.109%

LSR vs. Mass Reflow

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