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LSR
Laser Selective Reflow
LSR (Laser Selective Reflow) is designed to deliver a uniform defocused laser beam over a specifically tailored area on a PCB. The uniform defocused beam is controlled and delivered to the product via the BSOM (Beam Shaping Optic Module system) on user defined area. This unique feature permits the user to implement novel soldering solutions not possible with past techniques. It also allows the selective application of energy to locations that require soldering while not heating up potentially thermally sensitive areas. LSR is potentially a means to also mitigate or even eliminate the warpage of various packages. It provides super reliable and fast, only few seconds laser bonding per selected area, bonding process. It was made possible by highly uniform optic system and distinctive recipe developed by Laserssel.
Strength of LSR
Extremely Fast Ramp up
Extremely Fast Cooling Rate
Highly Selective Area Heating
Smaller Warpage
Less Floor Space
Energy Saving
within 0.5sec
65°C/sec (Mass Reflow 3.7°C/sec)
Heat Si only
No PCB elongation
5 to 10 step temperature zone not required
10~30m2/hr N2 Purge not required
Very Fast Tact time
LSR
Total 0.5~4sec
Mass Reflow
Total 4~8min
Every Process is super accelerated
LSR vs Mass Reflow
VS
Conventional Reflow heats up entire atmosphere. But, LSR only heats up where soldering takes place.
LSR will generate minimal damage on substrate undergoing reflow process.
ITEM
Method
Laser Power
Energy Density
Beam Size
Temp. Devation
UPH
Cycle Time
Foot Print
Power consumption
LSR
Laser
2kW
5W/㎠ ~ 50W/㎠
Max 45㎜
<5°
1.8k(CSP/1 die),
72k(CSP/4 multi dies
2sec
1,300(W)x1 ,100(D)x1, 760(H)
2kW
Mass Reflow
Heater (IR, Ceramic)
N/A
N/A
N/A
<10°
2,000 ~ 2,200(CSP)
N/A
6,200(W)x1, 370(D)x1, 600(H)
12kW
Beam Uniformity of BSOM
Beam size 45x45mm
Uniformity X: 88.329% / Y:90.109%
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