LSR

Laser Selective Reflow

LSR (Laser Selective Reflow) is designed to deliver a uniform defocused laser beam over a specifically tailored area on a PCB. The uniform defocused beam is controlled and delivered to the product via the BSOM (Beam Shaping Optic Module system) on user defined area. This unique feature permits the user to implement novel soldering solutions not possible with past techniques.  It also allows the selective application of energy to locations that require soldering while not heating up potentially thermally sensitive areas. LSR is potentially a means to also mitigate or even eliminate the warpage of various packages. It provides super reliable and fast, only few seconds laser bonding per selected area, bonding process. It was made possible by highly uniform optic system and distinctive recipe developed by Laserssel. 

Strength of LSR

Extremely Fast Ramp up

Extremely Fast Cooling Rate

Highly Selective Area Heating

Smaller Warpage

Less Floor Space

Energy Saving

within 0.5sec

65°C/sec (Mass Reflow  3.7°C/sec)

Heat Si only

No PCB elongation


5 to 10 step temperature zone not required
 

10~30m2/hr N2 Purge not required

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Very Fast Tact time

LSR

Total 0.5~4sec

Mass Reflow

Total 4~8min

Every Process is super accelerated

LSR vs Mass Reflow

VS

Conventional Reflow heats up entire atmosphere. But, LSR only heats up where soldering takes place.

LSR will generate minimal damage on substrate undergoing reflow process.

ITEM

Method
Laser Power
Energy Density
Beam Size

Temp. Devation
UPH

Cycle  Time
Foot Print
Power consumption

LSR

Laser
2kW
5W/㎠ ~ 50W/㎠
Max 45㎜
<5°

1.8k(CSP/1 die),
72k(CSP/4 multi dies
2sec

1,300(W)x1 ,100(D)x1, 760(H)
2kW

Mass Reflow

Heater (IR, Ceramic)
N/A
N/A
N/A
<10°
2,000 ~ 2,200(CSP)

N/A
6,200(W)x1, 370(D)x1, 600(H)

12kW

Beam Uniformity of BSOM

Beam size 45x45mm, Uniformity X: 88.329% / Y:90.109%