Perfect 40micron pitch solder bump reflowed by LSR.
Laser Process Recipe : Bonding Quality 1
LSR uses shorter TAL compared to Mass Reflow.
Cooling speed is directly related to formation of multi grain and uniform & thin formation of Intermetallic compounds.
It is known that multi grain and uniform & thin brittle gives better shear strength.
Laser Process Recipe : Bonding Quality 2
IMC Layer: LSR vs MR/TCB
Thickness of Intermetallic Compound(IMC) of LSR is ¼ thinner.
Material characteristic of IMC is normally Brittle.
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