What is LSR? | BSOM | LSR Reliability
LSR Reliability
Semiconductor(Fine Pitch)
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Perfect 40micron pitch solder bump reflowed by LSR.
Laser Process Recipe : Bonding Quality 1
LSR
Mass Reflow
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LSR uses shorter TAL compared to Mass Reflow.
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Cooling speed is directly related to formation of multi grain and uniform & thin formation of Intermetallic compounds.
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It is known that multi grain and uniform & thin brittle gives better shear strength.
Laser Process Recipe : Bonding Quality 2
IMC Layer: LSR vs MR/TCB
A: 1sec
B: 5sec
MR: 65sec
[TAL]
Thickness of Intermetallic Compound(IMC) of LSR is ¼ thinner.
Material characteristic of IMC is normally Brittle.
LR-Profile A
TAL 1s
MR samples
TAL 65s
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