What is LSR? | BSOM | LSR Reliability

LSR Reliability

Semiconductor(Fine Pitch)

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  • Perfect 40micron pitch solder bump reflowed by LSR.

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Laser Process Recipe : Bonding Quality 1

LSR

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Mass Reflow

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  • LSR uses shorter TAL compared to Mass Reflow.

  • Cooling speed is directly related to formation of multi grain and uniform & thin formation of Intermetallic compounds.

  • It is known that multi grain and uniform & thin brittle gives better shear strength.

Laser Process Recipe : Bonding Quality 2

IMC Layer: LSR vs MR/TCB

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A: 1sec

B: 5sec

MR: 65sec

[TAL] 

Thickness of Intermetallic Compound(IMC) of LSR is ¼ thinner.

Material characteristic of IMC is normally Brittle.

LR-Profile A

TAL 1s

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MR samples

TAL 65s

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