Beam Shaping Optic Module
Area∙Laser & Optic System Technology
“World First & Only Area∙Laser & Optic System Technology.
Owns World’s Most Various Optic Spec”
World’s Most Various Beam Size
0.1mm ~ 300mm
Resizable Laser Optic System
Fixed ~ Variable Laser Optic
World’s Best Laser Beam Uniformity
Conventional laser machines for cutting and welding / bonding use spot beam (Gaussian shape) laser.
Spot beam has center concentrated energy distribution, and because of this characteristic of spot beam, it is not suitable in processes where bonding uniformity matters.
Also, uneven heat distribution and heat transfer time in bonding area also occurs. It can cause serious quality problems. Our Laser reflow equipment uses unique Laser system that has a flat top(uniform thermal distribution) beam based on Laserssel’s patented Laser optic design and can dramatically increase productivity and quality of product.
Because of flat top beam technology, heat can be uniformly applied to devices and can significantly minimize warpage related issues.
Shape and size of flat top beam is changeable during process with zoom optics design based on customer’s requests for various applications.
Our technology can be adopted in application for fine pitch semiconductor packaging or reflow process that are sensitive to substrates thermal behavior such as flexible PCB. Apply heat only on area where needed. Apply heat for just seconds (not minutes like conventional reflow machines). It will solve many issues caused by conventional ceramic/IR based reflow system.
Why Laserssel? Why Area∙Laser?
“Area∙Laser”, enhancing existing Back-end Issue, provides Dramatically Improved Productivity & Reliability
Advanced Package Solution
LSR vs Mass Reflow
Area∙Laser Bonding Applications
Ultra Thin PCB
Whole PCB Reflow
FPCB + FPCB
Via Hole (Capacitor, Connector)
FPCB + Rigid
Rigid + Rigid