BSOM (Beam Shaping Optic Module)
Area Laser Selective Reflow
Gaussian Beam To Area Beam
- Spot Beam to Area Beam
- Increased Productivity
- Minimized Warpage
- Minimized Thermal Damage
Core technology of Laserssel is BSOM (Beam Shaping Optic Module system)
LSR uses BSOM to transform spot beam to area beam.
This LSR dramatically reduces substrate warpage by heating small selected area leaving majority of area unheated(no damage to other area of PCB).
Moreover, Area Laser does not make hot spot(high energy density) which is often key problematic issue with Spot Laser reflow system.
Heating only Selected Laser Region
When area laser is applied on chips, only chips are being heated up to targeted reflow temperature. Immediate outside of Laser beam area shows dramatically lower temperature as seen on infrared camera image above.
Area Laser Beam Profile
Beam Size : 4 to 45mm
Real time temperature monitoring by IR Camera
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