Product
One & Only Area∙Laser Total Solution Provider in World
BSOM series
Beam Shaping Optic Module
• World Best & Most various Area∙Laser Beam Size supported (6type, 40model)
• World Best Area∙Laser with over 95% beam uniformity
NBOL series
iNnovation Bonding Optical Laser
• Optimal Cooling System integrated High Power Laser System
• Essential Device for Advanced Tech Area∙Laser Process
LSR · LCB series
Laser Selective Reflow
Laser Compression Bonder
• Main Lineup of Laserssel’s Laser Reflow Equipment for Semiconductor, EV components and general SMT use
• World First Area∙Laser Bonding Equipment dedicated for Next Gen Semicon for ZeroWarpage Package with GyroCompression Robot
Semiconductor
LSR
Laser Selective Reflow
Laserssel’s standard equipment that reflows selected area for few seconds with uniform Area∙Laser eliminating thermal damage or warpage
Only 3 seconds reflow
ITEM | SPECIFICATION | Remark | ||
|---|---|---|---|---|
Material | Substrate | Substrate Size (L x W) | 240 x 80 mm / 300 x 300 mm
(Width : 60 ~ 180mm) | Variable |
Machine | Laser | Power | 2 ~ 12kW | |
Optic | Beam Size | 80 x 80mm ~ 300 x 300mm (Variable) | ||
Beam Uniformity | > 90% | |||
Dimension | 1,950 x 2,500 x 2,250 mm | |||
Special Function | Function | IR Camera | Real Time Temperature Monitoring | |
Power meter | Laser Power Monitoring / Calibration | |||
Beam profile | Beam size & Density Monitoring | Option |
Display
rLSR
rework Laser Selective Reflow
Mini LED rework without damage on LED/PCB
LSR technology or equipment to remove defective mini LED, semiconductor components and chips from substrate and to replace with new components using Area∙Laser.
for mini/micro LED laser rework
Title | 텍스트 | 텍스트 | 텍스트 | 텍스트 |
|---|---|---|---|---|
PCB loading/unloading | ||||
Tact Time | 45~60sec per 1 LED including | |||
Automation | Support SMEMA, MES, EIP, DFS | |||
Special Function | Function | IR Camera | Real Time Temperature Monitoring | |
Dimension | 1,300 x 2,200 x 1,800 mm | |||
Beam Uniformity | >90% | |||
Optic | Beam Size | 100 x 300 um | Variable | |
Machine | Laser | Power | 30 ~ 200W | Variable |
Chip (or Wafer) | Chip Size (L x W) | 100 x 150 um ~ 600 x 600 um | Variable | |
Material | PCB | PCB Size (L x W) | Max 400 x 700 mm (Include carrier) | Variable |
Electric Vehicle
LSR
Laser Selective Reflow
Area∙Laser reflow on thermally sensitive substrate
LSR has install base on numerous electric vehicle application such as bonding components on thermally sensitive substrates or on power modules where superior reliability is required.
for Electric Vehicle
ITEM | SPECIFICATION | REMARK | ||
|---|---|---|---|---|
Beam profile | Beam size & Density Monitoring | Option | ||
Special Function | Function | IR Camera | Real Time Temperature Monitoring | |
Power meter | Laser power auto calibration | |||
Dimension | 1,700 x 1,750 x 1,660 mm | |||
Beam Uniformity | > 90% | |||
Optic | Beam Size | 20 x 8 mm ~ 40 x 16 mm | Variable | |
Machine | Laser | Power | 500W | TBD |
Material | PCB | PCB Size (L x W) | Max 800 x 400mm | Palette |
Device
BSOM
Beam Shaping Optic Module
Laserssel invented Laser Optic System that transforms Laser Spot beam to uniform Area Beam.
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PC(Plate-type Cylindrical-lens) type
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LP(Light Pipe) type
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SC(Square Core-fiber) type
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DOE(Diffractive Optic Element) type
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MLA(Micro Lens Array) type
-
CD type : Coaxial Dual type
ITEM | SPECIFICATION | |
|---|---|---|
Variable type | Fixed, Manual & Auto Variable | |
Beam shape | Rectangular, Square, Line | |
Beam Size Range | mm | 0.1 to 300 |
Optical Power Efficiency | % | > 90 |
Beam Steepness | mm | < 2 |
Beam Uniformity | % | > 90 |
Central Wavelength | nm | 980 or 1080 |