Most advanced semiconductor products demanded in AI, 5G, IoT, autonomous driving industry are facing critical packaging challenges such as warpage. Such issues in thin die package with die thickness thinner than 50um, interposer package and multi stacked dies that often has fine solder bump pitch with dramatically increased number of IOs are broadly seeing this warpage problem.

Laserssel invented LSR based on Area Laser technology is the proven warpage-free bonding solution.