THE WORLD BEST
LASER SELECTIVE REFLOW
SOLUTION PROVIDER
OUR
BUSINESS AREA
Pursuit of more functionality and performance in smaller/ thinner devices
SEMICONDUCTOR
Most advanced semiconductor products are facing challenges today from diverse directions. Thin die and substrates are becoming more difficult to build package without warpage. Interposer packaging, multi stacked packages and very fine pitch solder bumps tend to create different kinds of issues with conventional reflow oven. It has been proven accurately controlled area laser can solve such problems.
MOBILE & WAREABLE
IoT has brought various forms of electric device substrates to use such as fabric, 3D polymer, bendable display, heat sensitive and warpage prone substrates. But, these new form of substrates tend to create issue with reflow process due to its heat sensitive characteristics. By heating up small selected area with area laser beam for few seconds, LSR turns various kinds of materials into ready to be used substrates.
ELECTRIC VEHICLE
EV uses various kinds of heat sensitive substrates where thermal monitor and control is critical. However, such heat sensitive substrates cannot be reflowed with conventional reflow due to its very low temperature specification. LSR with its aimed soldering with area Laser enables automating soldering components to these heat sensitive substrate.
OUR TECHNOLOGY
AREA LASER SELECTIVE REFLOW
Laser Selective Reflow (LSR) is designed to deliver a uniform defocused laser beam over a specifically tailored area on a PCB. The uniform defocused beam is controlled and delivered to the product via the BSOM(Beam Shaping Optic Module) on user defined area. This unique feature permits the user to implement novel soldering solutions not possible with past techniques. It also allows the selective application of energy to locations that require soldering while not heating up potentially thermally sensitive areas. LSR is potentially a means to also mitigate or even eliminate the warpage of various packages. It provides super reliable and fast, only 1~3 seconds laser bonding per selected area, bonding process. It was made possible by highly uniform optic system and distinctive recipe developed by Laserssel.
LSR
OUR
GLOBAL NETWORKS
OUR
QUALITY ASSURANCE
IPC Specialist
Certification
IPC-A-610
Acceptability of Electronic Assemblies
is hereby desgnated
Cetified IPC Specialist.
