LASER SOLUTION PLATFORM
Laser Selective Reflow (LSR) uses a uniform defocused laser beam over a specifically tailored area on a PCB with controlled beam intensity to implement novel soldering on specific component(or several components) while not heating up potentially thermally sensitive area adjacent to it. It also provides super reliable and fast, only 1~3 seconds laser bonding per selected area, bonding process.
Pursuit of more functionality and performance in smaller/ thinner devices
Mini LED BLU has become a good alternative to OLED display in recent Mid to Large size display.
OLED had been dominating display in mobile and television industry with 1,000,000 : 1 contrast ratio, superior to LCD, but also had downfall in burn-in issue and high cost.
Mini LED used as LCB back light unit(BLU) started to emerge as strong competitor of OLED in year 2021 by extensive improvement on those two issues mentioned above, burn-in and cost. Now daily news is covered with updates of mini LED BLU in Pads, Note PC, monitor and TV.
Mini LED BLU is an array of tens of thousands of tiny LED as small as 100 microns in size and each LED needs to be reflowed and reworked by LSR to get best quality in bonding strength, warpage and surface damage.
Most advanced semiconductor products like A.I,GPU, CPU and HBMs are facing challenges today from diverse directions. Thin die and substrates are becoming more difficult to build package without warpage. Interposer packaging, multi stacked packages and very fine pitch solder bumps tend to create different kinds of issues with conventional reflow oven. It has been proven accurately controlled area laser can solve such problems.
MOBILE & WEARABLE
IoT has brought various forms of electric device substrates to use such as fabric, 3D polymer, bendable display, heat sensitive and warpage prone substrates. But, these new form of substrates tend to create issue with reflow process due to its heat sensitive characteristics. By heating up small selected area with area laser beam for few seconds, LSR turns various kinds of materials into ready to be used substrates.
EV uses various kinds of heat sensitive substrates where thermal monitor and control is critical. However, such heat sensitive substrates cannot be reflowed with conventional reflow due to its very low temperature specification. LSR with its aimed soldering with area Laser enables automating soldering components to these heat sensitive substrate.
AREA LASER SELECTIVE REFLOW
Laser Selective Reflow (LSR) is designed to deliver a uniform defocused laser beam over a specifically tailored area on a PCB. The uniform defocused beam is controlled and delivered to the product via the BSOM(Beam Shaping Optic Module) on user defined area. This unique feature permits the user to implement novel soldering solutions not possible with past techniques. It also allows the selective application of energy to locations that require soldering while not heating up potentially thermally sensitive areas. LSR is potentially a means to also mitigate or even eliminate the warpage of various packages. It provides super reliable and fast, only 1~3 seconds laser bonding per selected area, bonding process. It was made possible by highly uniform optic system and distinctive recipe developed by Laserssel.
Acceptability of Electronic Assemblies
is hereby desgnated
Cetified IPC Specialist.
2020 Korean Venture of the year Award
(Ministry of SME and Startups)
2019 Global Technology Award
(Mexico EMS Technology Award)
SMTA Guadulajara Mexico